hi everyone,
I'm a beginner in PCB and I'm following this tutorial http://youtu.be/oGfvVkD_3lU
After pouring copper planes, we verify connectivity between pins and planes using thermal relief. In theory, there will be 4 situation:
Pic. 1 means you haven't cheked the Thermal pads option in Design Parameters, but after I check the option, I'm still in Pic 1. Does anyone have experience of this?
thanks